Samsung Galaxy S9 to feature larger battery and smaller PCB

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The new technology is rumored to only be used in units powered by the Exynos chipset, while the units with Qualcomm Inc. processors will retain the High-Density Interconnect technology. This is expected to build up a larger room for the battery in the smartphone. As a result, there is little scope for increasing the battery size, especially as vendors are trying to make their phones slimmer. Once Samsung finalizes the switch to SLP, the number of suppliers will be reduced to four. After deciding to apply integrated touch display to its strategic Smartphone that is expected to be released during first half of 2018, it has now made a decision to use 'SLP (Substrate Like PCB)' as the main board.

SLP is a main board for next-generation Smartphones and is the developed form of HDI (High Density Interconnect) that is now the mainstream.

If Samsung does end up doing this, it will be the first time that it adopts the advanced logic board based on chip packaging technology. The tech giant will be cutting the size of motherboard in its smartphones by using a different technology.

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With the Galaxy S9, we should hope for better things to come as far as improved battery timings are concerned. It is heard that Apple also chose to use SLP for its new iPhone, which is expected to be released this fall, due to this strength of SLP.

According to analyst Ming-Chi Kuo of KGI Securities, Samsung will instead stick to its rear-mounted fingerprint sensor found on the Galaxy S8, which will likely disappoint users who weren't thrilled with the feature in the current flagship. Kuo noted that Samsung has ditched Synaptics, and will go ahead with Egis for the Galaxy Note 9 optical fingerprint scanner. Other expected features include 8GB RAM, 128GB/256GB of built-in storage, Android O software, dual camera system, and wireless charging.

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